The formation of internal stress in molding is basically caused by different thermal shrinkage rates during cooling. After the product is molded, its cooling gradually extends from the surface to the inside. The surface first shrinks and hardens, and then gradually to the inside. In this process, the difference in speed and shrinkage results in internal stress.
When the residual internal stress in the plastic part is higher than the elastic limit of the resin, or under a certain chemical environment, cracks will occur on the surface of the plastic part. Research on PC and PMMA transparent resins shows that the residual internal stress is in a compressed form on the surface layer and a stretched form in the inner layer.
The level of surface compressive stress depends on the cooling condition of the surface. The cold mold quickly cools down the molten resin, which causes the molded product to produce higher residual internal stress. Mold temperature is the most basic condition for controlling internal stress. A slight change of mold temperature will greatly change its residual internal stress. Generally speaking, the acceptable internal stress of each product and resin has its minimum mold temperature limit. When molding thin walls or longer flow distances, the mold temperature should be higher than the minimum for general molding.